Product Specification 108 - 19460 08 Aug 13 Rev. A Splash proof micro-USB Connector “The product may not perform according to the product specification if precautions have not been taken in the application to provide mechanical stability of the connector in relation to its mating parts"._ 1.1 Content. This specification covers performance, test and quality requirements for a Tyco Electronics* splash proof micro-USB connector. The connector is designed to be used in portable devices with splash proof requirements. 1.2 Qualification. When tests are performed on subject product, procedures specified in this specification shall be used. All inspections shall be performed using applicable inspection plan and product drawing. 2 APPLICABLE DOCUMENTS. The following documents form a part of this specification to the extend specified here. Unless otherwise specified, latest edition of the document applies. In the event of conflict between the requirements in this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between requirements of this specification and referenced documents, this specification shall take precedence. 2.1 Tyco Electronics Documents. 501-19198 Test report of “splash proof micro-USB connector AB-type”. 2.2 Tyco Electronics Drawings. C-1551629 Customer drawing of " splash proof micro-USB connector AB-type" C-2173157 Customer drawing of " splash proof micro-USB connector B-type" 2.3 Other Documents. IEC 60512 Basic testing procedures and measuring methods for electromechanical components for electronic equipment. IEC 60068 Basic environmental testing procedures. USB-IF MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 Tyco Electronics Nederland B.V. All international rights reserved Tyco Electronics *Trademark R6-76 (Rev. 07-01) This information is confidential and propriety to Tyco Electronics and its worldwide subsidiaries and affiliates. It may not be disclosed to anyone, other than Tyco Electronics personnel, without written authorization from Tyco Electronics Corporation, Harisburg, Pennsylvania USA This specification is a controlled document and subject to change. Contact the Engineering Control Organization for the latest revision.

108-19460 3.1 Design and Construction: Products shall be of design, construction and physical dimensions as specified on the applicable product drawing. Plating: B. Housing material: - Cu-alloy. - Post-plated with nickel and gold. - Thermo-Plastic, LCP - Stainless Steel - Post-plated with nickel and tin - Thermo-Plastic, LCP - HM-15 to be applied to contact - HP-300 to be applied to shell B. Current: - signal contacts only Pin 2, 3 & 4: 1A max. - with power applied contacts Pin 1 & 5: 1,8A max. Pin 2,3 & 4: 0,5A max.

108-19460 3.4 PERFORMANCE AND TEST DESCRIPTION The product is designed to meet electrical, mechanical and environmental performance specified in this paragraph as tested per test sequence specified in par. 3.6. The product is designed to meet electrical, mechanical and environmental performance specified (according Nokia draft spec. xxx-xxxxxxx) in this paragraph as tested per test sequence specified in Para 5.1. Unless otherwise specified, all tests are performed at ambient environmental conditions per IEC specification 60068-1 clause 5.3. and are performed with connectors in mated conditions....

Additional testing details. Figure 1 Test Cover for mechanical tests

3.5.2 Contact resistance measurement left down Power Supply U Figure 2 Contact resistance measurement

108-19460 3.5.3 Resistance to soldering heat Resistance to soldering-heat test shall cover the Forced hot air convection (reflow) heat curve as indicated in figure 3. ref. IPC/JEDEC J-STD-020B with increased T peak (TP). Between exposures, parts shall be allowed to cool down to room temperature, for 5 minutes minimum. Profile feature Note: All temperatures refer to topside of the package, measured on the package body surface.

108-19460 3.6 Product Qualification and Requalification Test Sequence.

108-19460 4 QUALITY ASSURANCE PROVISIONS. 4.1 Qualification testing. A. Sample selection Samples shall be prepared in accordance with applicable instructions and shall be selected at random from current production. Samples shall be soldered on PWB. B. Test sequence Qualification inspection shall be verified by testing samples as specified in par. 3.6. 4.2 Requalification testing. If changes significantly affecting form, fit or function are made to product or manufacturing process, product assurance shall coordinate requalification testing, consisting of all or part of original testing sequence...