EddyCus® TF map 5050 series

Product catalog summary

Overview: The EddyCus® TF map 5050 series by SURAGUS GmbH is a non-contact sheet resistance mapper designed for efficient testing solutions across various applications such as touch panel sensors, OLED & LED applications, smart-glass, photovoltaics, semiconductors, de-icing & heating applications, batteries & fuel cells, and packaging materials.

Highlights: The system offers contact-free and real-time testing with accurate high-resolution imaging for sheet resistance (Ohm/sq) and layer thickness of metal films (nm). It also provides substrate thickness mapping of metal foils (µm) and mapping of encapsulated layers. The software allows multiple analysis possibilities.

Materials: The device is suitable for printed films, graphene, CNT, conductive oxides, metal films and meshes, and other conductive layers.

Technical Specifications:

Measurement Technology: Non-contact eddy current sensor.
Substrates: Suitable for foil, glass, wafer.
Max Scanning Area: 20 inch / 508 x 508 mm (larger on request).
Edge Effect Correction: 2 mm edge exclusion for standard size.
Max Sample Thickness/Sensor Gap: 2 / 5 / 10 / 25 mm.
Sheet Resistance Range and Accuracy: 0.001 – 10 Ohm/sq < 2% accuracy, 10 – 100 Ohm/sq < 3% accuracy, 100 – 1,000 Ohm/sq < 5% accuracy.
Thickness Mapping: 2 nm – 2 mm for metal films.
Scanning Pitch: 1 / 2 / 5 mm / 10 mm.
Measurement Points: 10,000 points in 5 minutes, 1,000,000 points in 30 minutes.
Scanning Time: 8 inch / 200 x 200 mm in 1.5 to 15 minutes, 12 inch / 300 x 300 mm in 3 to 30 minutes.
Device Dimensions/Weight: 46.5 x 11.4 x 35.4 inch / 1180 x 290 x 900 mm / 120 kg.

Available Features: Includes a metal thickness tester, anisotropy sheet resistance sensor, and optical transmission sensors at 632 nm wavelength.

Software & Handling: The device is equipped with the Sheet Resistance Analyzer 2.0 software for enhanced data analysis and handling.

Catalog excerpts

Efficient Testing Solutions Non-Contact Sheet Resistance Mapper DATA SHEET - EddyCus® TF map 5050 series HIGHLIGHTS > Touch Panel Sensor  Accurate high resolution imaging system  sheet resistance imaging (Ohm/sq)  Layer thickness imaging of metal films (nm)  Substrate thickness of metal foils (µm)  Mapping of encapsulated layers > De-icing & heating applications  Multiple possibilities of analyzing the mapping by > Batteries & fuel cells MATERIALS  Printed films  Graphene, CNT  Conductive oxides  Metal films and meshes  Other conductive layers SURAGUS GmbH Maria-Reiche-Str. 1 01109 Dresden Germany

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DATA SHEET EddyCus® TF map 5050 series – Sheet Resistance Mapping EddyCus® TF map 5050SR series Measurement technology Substrates Max. scanning area Edge effect correction / exclusion Max. sample thickness/ sensor gap Sheet resistance range and accuracy Thickness mapping of metal films (e.g. Aluminum, Copper) Scanning pitch Measurement points per time (quadratic shape) Scanning time Non-contact eddy current sensor e.g. foil, glass, wafer 20 inch / 508 x 508 mm (larger on request) 2 mm edge exclusion for standard size 2 / 5 / 10 / 25 mm (defined by the thickest sample/ application) 0.001 – 10...

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EddyCus® TF map 5050 series

EddyCus® TF map 5050 series

Catalog excerpts

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