WideXcan
WideXcan
WideXcan is an advanced R-X imaging system designed for large format scanning, particularly suitable for aeronautical components. It offers digital radiography capabilities for large structures with a scanning size of up to 4000 x 3000 mm, extendable on demand.
- Scanning Size: Up to 4000 x 3000 mm
- Pixel Size: 100 µm
- Pixel Matrix: 4200 x 3400
- Focal Spot: Minimum 20 µm
- Gray Level Resolution: 16 bits
- Max Power: 90W (0.5 mA)
- Max Energy: 180 kV
- Safe inspection of aeronautical components
- Digital radiography for large structures
- Voltage Range: 40 to 180 kV
- Current Range: 10 to 500 µA
- Focal Spot Size: 20 µm at 4 W
- Output Window Material: Beryllium, 0.5 mm
- Beam Angle: 62º
- Focus to Object Distance: 19.8 mm
- Target Material: Tungsten
- Weight: 38 kg
- Panel: Amorphous silicon
- Scintillator: Direct deposition CsI:Tl
- Pixel Pitch: 100 µm
- Shielding: 2 mm of tungsten
- Dynamic Range: > 77 db
- Imaging Lag: < 8% 1st frame
- Operating System: Windows XP, 10
- Interface: Ethernet
- Communication Method: RS-232C
- Dimensions: 4475 x 3600 x 1080 mm
- Material: Aluminum and stainless steel
- EN 60601-1/A1, EN 60601-1-2
- FCC part 15 subpart E
- ETSI EN 301 893 V2.1.1
- ETSI EN 301 489-1 V2.2.0
- ETSI EN 301 489-17 V3.2.0
- EN ISO 10993-5, EN ISO 10993
- Software for controlling WideXcan, allowing easy positioning and automatic communication with Det-X for image acquisition.
- ChronoX and Det-X for fast and intuitive image acquisition, supporting both asynchronous and synchronous control.
- Email: [email protected]
- Phone: (+34) 983 347 328
- Website: www.novadep.com
Catalog excerpts
R-X imaging of large formats © Novadep MHT ■ Digital radiography for large structures!_Key features I Pixel Size: 100 pm Gray Level Resolution: 16 bits Scanning Size: Safe inspection of aeronautical components See all our products at novadep.com/products
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Technical characteristics X-RAY TUBE Voltage operational range Current operational range Maximum output Focal spot size Output window material Beam angle Focus to object distance (FOD) Target material Communication method Laser pointer Camera On-board camera SENSOR Panel Scintillator Pixel Matrix Pixel Pitch Shielding Binning Modes Amplifiers ADC Image Transfer Time Active Area Dynamic Mode On-board Corrections Typical SRb Dynamic range Imaging lag Radiation Energy Amorphous silicon Direct deposition CshTI 4200x3400 100pm Low noise ASICs with Again levels 16-hit Wireless: 3000/600/200 ms 42 mm...
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