#NOHUB IMAGING BOND TESTER Multimode Imaging Bond Tester NDT Systems Inc is proud to announce the launch of the world’s first multimode imaging bond tester with fully automatic C-scan imaging capability. The BondHub Imaging Bond Tester utilizes the full capability of the well-established Bondascope 3100 and connects to any of our manual or automatic scanners to generate high-resolution C-scan images in Pitch-catch, MIA and Resonance modes. Inspection of composites and adhesively bonded materials has not seen such an advancement for many years. The power of full-field inspection images using bond testing elevates non-destructive inspection capability to a new level. Imaging Bond Testing offers many advantages including: • Easy interpretation • Increased probability of detection • Digital Archiving of results • Pitch-catch and MIA modes require no couplant • More consistent and reliable results • Reduced effect of human error on results • Increased speed of inspection

W*fOf-fL/OIMAGING BOND TESTER Applications • Integrity of composites and adhesively bonded structures • Multi-layered laminates, glass fiber/ carbon fiber composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings • Delaminations, disbonds, crushed core, skin to core flaws, far-side defects, impact damage, liquid ingress and more Features • C-scan Imaging using Resonance, Pitch-Catch and Mechanical Impedance (MIA) modes • No couplant required for Pitch-Catch and MIA modes • Image analysis, defect sizing, multiple gates, reporting • Portable, battery operated system,...