BondaScope 3100
2Pages

1 Worldwide Excellence in Ultrasonics Applications • Integrity of composites and adhesively bonded structures • Multi-layered laminates, glass fiber/ carbon fiber composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings • Delaminations, disbonds, skin to core flaws, far-side defects, impact damage, liquid Ingress • Resonance, Pitch-Catch and Mechanical Impedance (MIA) modes • Display modes: RF, Impedance plane, Flying dot, Sweep, time-encoded profile • Automatic Probe recognition and probe library • Programmable user setups • Tone burst, high energy pulsed mode, swept frequency BondaScope 3100- Multimode bond tester for checking the integrity of bondlines Introduction As the use of adhesively bonded joints and fittings has increased across many industries, the need for testing bond integrity has grown. Metal to metal bonded joints, sandwich constructions with various skin and core materials, bonded carbon fiber composite structures have all become important in manufacturing as well as in-service repair patches and adhesively bonded re-enforcements. The integrity of these bonds is critical to the quality of the final product. Conventional ultrasonic methods can be limited for these applications and so a variety of alternative methods have been developed to handle this range of material combinations. Portable Bond Testing The BondaScope 3100 is a handheld, battery operated ultrasonic bond tester that uses 3 different testing modes to cover a range of applications. Operating typically between 20kHz-400kHz, the lower frequency, compared to conventional ultrasonic testing, enables deeper penetration through attenuating materials, across multiple glue lines and even sandwich cores to detect far-side defects. The different display modes are optimized for different applications with a variety of gates and alarms to easily identify a flaw. Multimode Operation The most common Pitch-catch (P/C) and Resonance modes are suited to laminates, bonded and sandwich structures. Pitch-catch is dry coupled, easy to use and works well on larger defects, >0.5". Resonance mode requires couplant, but can identify smaller defects and even determine which layer the defect occurred in with multi-layered bonded structures. Mechanical Impedance Analysis (MIA) mode is dry coupled and most suited to metal-to-metal bonding and stiffer skin to core constructions. It has less penetration but works well on irregular and curved surfaces and with the small tip can accurately position the location of the defect. Nnova INSTRUMENTS

6 Inspection Methods When a probe is connected to the Bondascope 3100, the automatic recognition optimizes the settings for the probe type. There are 6 inspection methods available: Pitch-Catch RF: Transmits a short burst of acoustic energy to the part and measures the amplitude and phase change of the received signal directly. A disbond reduces sound attenuation into the part leading to a higher amplitude at the receiver. Pitch-Catch Pulsed: Transmits a spike pulse of broadband acoustic energy into the part and measures the amplitude of the received signal. Pitch-Catch Swept: Transmits a...