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W-Ti Sputtering Targets

W-Ti Sputtering Targets

W-Ti Sputtering Targets

Product catalog summary
Overview
Materion Advanced Materials Group specializes in high-quality Tungsten-Titanium (W-Ti) sputtering targets for thin film deposition. These targets are designed to produce low-defect, high-performance W-Ti thin films.

Target Specifications
  • Alloy Composition: 5 - 30% wt% Ti
  • Compositional Tolerance: Typically ±0.5wt%
  • Purity: Up to 99.999%
  • Grain Size: Typically <20μm
  • Form Factor: Up to 17.5" (450mm) diameter monolithic

Benefits
  • Low particulation rate due to low porosity and inclusion content.
  • High deposition uniformity from consistent grain size and phase structure.
  • Consistent performance over the target's lifetime.
  • Large lot sizes for consistency in large volume applications.
  • High purity suitable for demanding applications.
  • Surface engineered to minimize flaking and reduce wafer defects.

Features
  • Customized microstructure for low particulation and high uniformity.
  • High density (>98%) with minimal density variation (<±0.5%).
  • Low defect content with minimal porosity and inclusions.
  • Engineered surfaces to suppress secondary flaking.
  • High purity with low oxygen and alkali content.
  • Consistent grain sizes of less than 20μm.

Applications
Materion's W-Ti sputtering targets are used in wafer bumping, as diffusion barrier layers, and as capping layers in interconnect metallization.
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Catalog excerpts

W-Ti Sputtering Targets-1

ADVANCED MATERIALS GROUP Tungsten - Titanium Sputtering Targets

 Open the catalog to page 1
W-Ti Sputtering Targets-2

Tungsten-Titanium (W-Ti) Sputtering Targets Materion Advanced Materials Group is an industry leader in producing superior quality products for thin film deposition markets and a worldwide supplier for W-Ti material. Our high purity W-Ti sputtering targets are specifically developed to produce low defect and high performance W-Ti thin films. FEATURES Our W-Ti targets’ microstructure and phase structure are customized for low particulation, high uniformity conductive films. High density and low variability across the target ■ >98% bulk density ■ Less than <+/-0.5% density variation across targets Low...

 Open the catalog to page 2
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