MICROELECTRONICS PACKAGING MATERIALS

Product catalog summary

Overview
The document discusses the challenges and solutions in microelectronics packaging materials, emphasizing the need for secure packaging to protect sensitive electronics. It highlights the importance of hermetic lids for various applications and the demand for low thermal resistance and RF loss in RF and microwave packages.

Solutions Offered

Highly reliable hermetic lids for delicate electronics.
Materials ranging from precious metals to epoxy-coated ceramics.
Ultra-clean braze alloys for high integrity joints.
Innovative ceramic packages for low thermal resistance and RF loss.
Customizable designs and materials for specific applications.

Benefits

Operations in North America, Singapore, and the Philippines.
Extensive tooling library with over 5000 stamped preforms and cover lids.
Support for various configurations, applications, and volume requirements.
Specialized precious metal alloys for solder applications.
Lead-free braze materials and gold & silver alloys for corrosion resistance.
Alloys with superior thermal and electrical conductivity.
Wide range of melting temperatures for consistent performance.

Product Categories

Lids: Hermetic and non-hermetic lids for various applications, including Combo-Lids®, Micro-Lids™, Seam Seal-Lids™, Solder Reflow-Lids™, Visi-Lids™, Epo-Lids™, and Ceramic Combo-Lids™.
Braze & Solder Alloys: Materials for microelectronic packaging and high-temperature joining, including AuSn Preforms, Braze Materials, SilSeal Materials, Solder Alloys, and Lead-free Solders.
Ceramic Packaging: RF & microwave packages with low thermal resistance and RF loss, including BeO Packages, CuPacks™, Epo-Lids™, Air Cavity Packages, and Plated Flanges.

Key Characteristics

Customized shapes and forms, including ribbon, wire, preforms, and powder.
Precious and non-precious metals and alloys.
Wide range of melting temperatures and superior conductivity.

Contact Information
Materion Advanced Materials Group is a global company providing advanced materials and services. Contact details include phone numbers for Europe, Asia, and the USA, along with an email address and website for further information.

Packaging Products Applications
The document provides a detailed table of various Combo-Lids® and their applications, materials used, and specific features, such as high reliability, non-magnetic properties, and hermetic sealing capabilities.

Catalog excerpts

ADVANCED MATERIALS GROUP Microelectronics Packaging Materials

Open the catalog to page 1

The Challenge To ensure optimal performance and reliability, sensitive electronics must be adequately protected by secure packaging. Hermetic lids are necessary for semiconductor, MEMS, medical or optical applications to shield devices from moisture. RF and microwave packages must meet the demand for very low thermal resistance and very low RF loss. Metals and alloys used for the joining of vacuum electronic devices must be free of contamination that could negatively impact performance. The Solution When it comes to packaging, we've got you covered! We offer a full range of products. n Highly...

Open the catalog to page 2

Materion ... Materials to Advance the World’s Technologies LIDS BRAZE & SOLDER ALLOYS CERAMIC PACKAGING We've got you covered - hermetic and non-hermetic lids for semiconductor, MEMS, medical or optical requirements: n Combo-Lids® - pre-assembled solder preform and lid n Micro-Lids™ - for packages smaller than .300 in2 n Seam Seal-Lids™ - for sealing heat sensitive electronics n Solder Reflow-Lids™ - cost alternative to Combo-Lids® n Visi-Lids™ - for optical packages n Epo-Lids™ - Epoxy-coated ceramic for non-hermetic uses n Ceramic Combo-Lids™ - for specialty applications Materials for microelectronic...

Open the catalog to page 3

Packaging Products Preform Material MATERION ADVANCED MATERIALS GROUP is a global advanced materials and services company, dedicated to providing solutions that enable our customers' technologies and drive their growth. Our products include precious and non-precious specialty metals, precision optical filters, inorganic chemicals and powders, specialty coatings, specialty-engineered beryllium alloys, beryllium and beryllium composites, and engineered clad and plated metal systems. The Materion business is structured to enhance our ability to provide customers with innovative, best total-cost...

Open the catalog to page 4

MICROELECTRONICS PACKAGING MATERIALS

MICROELECTRONICS PACKAGING MATERIALS

Catalog excerpts

All Materion Brush Ltd catalogs and technical brochures