Adhesives, Sealants & Coatings for the Aerospace Industry

Master Bond Inc. manufactures a comprehensive line of liquid, paste and film adhesives designed to provide unmatched performance for the aerospace industry. Products ensure reliability in the assembly of aircraft structures, components, interiors, and MRO applications. They are widely used for structural bonding, sealing and gap filling. Conformal coatings and potting/encapsulation compounds protect sensitive electronic parts against extreme conditions. Advanced systems offer many outstanding performance properties. They can be formulated for toughness, high temperature resistance, cryogenic serviceability,...

We have what you need... Typical Applications Master Bond compounds are utilized in thousands of applications all over the world. From prototype to assembly line, our cutting edge polymer systems have kept pace with the rapidly changing needs of the aviation industry. Manufacturers of commercial, military, business aircraft, helicopters, satellites, missiles and unmanned air vehicles (UAV's) have successfully employed Master Bond to meet challenging requirements. We will help you find the most suitable material for your application and offer you assistance from the design stage through the manufacturing...

Products for the Aerospace Industry Product Bonding/ Sealing Potting/ Encapsulation Electrically Insulative Electrically Conductive Thermally Conductive ONE COMPONENT HEAT CURING EPOXIES EP13

Bonding/ I c I Potting/ I Electrically I Electrically I Thermally I PageSealing oa ing Encapsulation Insulative Conductive Conductive No.TWOCOMPONENT EPOXIES (continued) EP90FR-HFL 23 MasterSil® SILICONES MasterSil 151AN

Potting/ Electrically Electrically Thermally Page Encapsulation Insulative Conductive Conductive No. MasterSil® SILICONES (continued) MasterSil 708FR SPECIALTY COMPOUNDS The most common applications for each Master Bond compound is depicted in the chart above. This does not imply a recommendation of a specific compound for a particular application, nor does it restrict the use of said compound in any application not mentioned in the table. Every recommendation is made by our technical specialists on a case-by-case basis.

EP13 Structural adhesive for high temperature applications Key Features Rigid curing EP13 has superior dimensional stability, bonds well to a wide variety of substrates and is machinable. s Structural adhesive with high tensile, lap shear and compressive strength properties s Outstanding heat resistance s Superb electrical insulation s Excellent chemical resistance Typical Properties Master Bond Inc. - Polymeric Compounds for Aerospace Manufacturing

EP17HT-LO Adhesive offers chemical and heat resistance up to 650°F Key Features This single component, thermally stable system has a glass transition temperature of 225°C. EP17HT-LO resists a variety of chemicals such as acids, bases, salts, fuels, oils and many solvents, even at elevated temperatures. s Extremely high glass transition temperature s Meets NASA low outgassing specifications s Excellent compressive/tensile strength properties s Low exotherm upon curing Master Bond Inc. - Polymeric Compounds for Aerospace Manufacturing

Supreme 10ANHT-LO Thermally conductive, electrically isolating epoxy Key Features Offering high strength properties, Supreme 10ANHT-LO is a single component heat curing system serviceable over a wide temperature range. s Outstanding thermal conductivity s Toughened system with superb shear/peel strength s Meets NASA low outgassing specifications s Excellent electrical insulation Master Bond Inc. - Polymeric Compounds for Aerospace Manufacturing

Key Features Supreme 10HT is a one part epoxy formulated to cure in 60-75 minutes at 250°F. It features processing advantages including no mixing prior to use, an “unlimited” working life at room temperature and no viscosity change over time. s Exceptionally high peel and lap shear strength s Meets NASA low outgassing specifications s Resists mechanical vibration and impact s Withstands thermal cycling Master Bond Inc. - Polymeric Compounds for Aerospace Manufacturing

Supreme 12AOHT-LO High temperature resistant, thermally conductive, electrically insulative epoxy Key Features Supreme 12AOHT-LO fully meets ASTM E595 for low outgassing and offers formidable bond strength. This toughened compound withstands shock, impact and thermal cycling. s Cryogenically serviceable s Smooth, thixotropic paste s Dimensional stability s Thermal stability up to 500°F Master Bond Inc. - Polymeric Compounds for Aerospace Manufacturing

EP36AO Flexibilized epoxy features thermal shock resistance Key Features EP36AO is a uniquely versatile, single component epoxy system that exhibits high thermal stability while maintaining outstanding physical strength. s Toughened, B-stage epoxy system s Excellent electrical insulation with high thermal conductivity s Available in 30 gram cookies s Ideal for potting and encapsulation Typical Properties Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

LATEST DEVELOPMENTS EP3SP5FL Ultra fast curing EP3SP5FL is recommended for high volume assembly applications. It is more readily repairable than most epoxies.     Cures in 1-2 minutes at 300°F Excellent electrical insulation Good flow properties Low shrinkage EP21HT-LO EP21HT-LO offers superior bond strength to similar and dissimilar substrates along with good heat resistance properties.     Excellent physical strength Meets NASA low outgassing specifications Convenient one to one mix ratio Good flow properties EP31 Two component epoxy adhesive, sealant and coating with exceptional peel...

Key Features Featuring low exotherm, EP21AOLV-2LO is a two part, room temperature curing epoxy used for potting, bonding, sealing and coating applications. s Meets NASA low outgassing specifications s Outstanding electrical insulation and heat dissipation properties s Long working life at room temperature s Suitable for large potting/casting applications Master Bond Inc. - Polymeric Compounds for Aerospace Manufacturing