ELECTRONIC INDUSTRY ADHESIVES I SEALANTS I COATINGS

Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. We offer a sweeping range of first-rate epoxy systems designed specifically for use in semiconductor packaging and assembly of electronics such as printed circuit boards. Using our extensive technical expertise, we offer these formulations with an array of performance and curing characteristics. Our unique ability to tailor products to each application’s specific needs, offers customers with reliable solutions and the ease of manufacturing. Product’s mechanical strength,...

Innovation tailored to your needs Kohesi Bond performance products are specially designed for successful use in your applications from initial prototyping to scaled-up production lines. Meeting new challenges of the electronic industry means inventing new technology. To make this happen, we offer you round-the-clock assistance right from the research and design phase through the manufacturing process. Typical Applications • Chip & Wire Bonding • Conformal Coating • Die-attach • EMI/RFI Shielding • Glob Top • Potting & Encapsulation • Printed Circuit Board Assembly • Thermal Management • Underfill •...

LIST OF PRODUCTS Product Electrically Electrically Thermally Bonding/ Potting/ Page Coating Conductive Insulative Conductive Sealing Encapsulation No. TWO COMPONENT EPOXIES (continued) √