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CMI563®
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Catalog excerpts

CMI563® - 1

Advanced surface copper measurement on single, double-sided, or multi-layer PCB Find out more These gauges are a great complement to our XRF coatings analysers. To place your order contact contact@hitachi-hightech-as.com MORE INFORMATION To find out more about the CMI563® or our range of PCB gauges, visit MICRORESISTANCE TECHNOLOGY FOR ACCURATE MEASUREMENT OF SURFACE COPPER The CMI563® provides advanced technology for accurate measurement on copper plating and it ensures that the opposite side of the PCB will not interfere with readings, regardless of laminate thickness. Our CMI563® makes it simple to obtain precise surface copper measurement on laminate, electroless, or electrolytic copper. This gauge is an ideally suited for: | PCB manufacturing and assembly. | Copper surface thickness. KEY FEATURES: | Advanced microsistance technology. | Factory calibrated. | Highly accurate copper thickness measurement. Our CMI563® provides superior performance for copper foil measurement on flexible or rigid, single, double-sided, or multi-layer boards. SRP-4 PROBE Included standard with the CMI563® gauge is a tethered SRP-4 probe with user-replaceable tips. This patented probe design consists of four pins securely encased for durability. Its see-through casing allows for easy placement. The tethered cable is ideal for field applications, and it has a small footprint for convenience. ADVANCED MICRORESISTANCE TECHNOLOGY MICRORESISTANCE TECHNOLOGY Microresistance makes the CMI563® highly accurate for electroless and electrodeposited copper applications, and even works on fine trace measurements. It uses four-point contact to generate an electrical signal. A current is passed between the outer pins, and voltage drop is measured between the inner pins of the sample. We have been providing coating thickness products for the PCB industry for over 40 ye

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