CCM03 MK2 Series
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Features • SIM/SAM card acceptance • Hinged and fixed covers • Compatible with pick and p lead free soldering Typical Applications • Handheld products • Identification and • POS • Automotive Mechanical Switch Electrical Data Number of Contacts Mechanical life, hinged cover Mechanical life, fixed cover Card insertion force Card extraction force Contact force Slide locking force Vibration Frequency Max electrical discontinuity Shock 6 or 8 10,000 cycles min 50,000 cycles Hinged cover: 1N max Fixed cover: 3N max Hinged cover: 1N max Fixed cover: 0,80N min / 3N max 0,25N min / 0,50N max 2N min / 6N max 1,8N max. for complete depression 10 to 500 Hz. Acceleration 50m/s2 Duration 6 hours - amplitude 0,35 mm 1gs Peak value 500 m/s2 - Duration 11 ms 3 shocks in each direction of each axis Card detection switch Contact resistance Dielectric strength Current rating Maximum power Normally open 100 mQ max 250 Vrms min 1 mA min / 10m A max 0.2 VA Environment Data Operating temperature Damp heat Salt mist RoHS compliant -40°C to +85°C IEC 512 test number 11c (10 days) IEC 512 test number 11f (96 hours) SIM/SAM Soldering Process Compatible with lead free SMT soldering process Contact Electrical Data Insulation resistance Resistance Current rating Dielectric strength * Can go through reflow upside down

MICROSIM CARD 2,55 (2,7 max. includes solder tails) Slider locked Pick and place area ø 3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) 1,5 Prohibited area Contact location according to ENV1375-1 & GSM11-11 Plastic outline Contact foot area 0,8 x 1 Dimensions are shown in mm Specifications and dimensions subject to change

MICROSIM CARD 2,55 (2,7 max. includes solder tails) Slider locked Pick and place area ø 3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) 1,5 Plastic outline Contact foot area 0,8 x 1 Pad Contact location according to ENV1375-1 & GSM11-11 Prohibited area Dimensions are shown in mm Specifications and dimensions subject to change

MICROSIM CARD 2,55 (2,7 max. includes solder tails) Slider locked Pick and place area ø 3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) 1,5 Prohibited area Contact location according to ENV1375-1 & GSM11-11 Plastic outline Contact foot area 0,8 x 1 Dimensions are shown in mm Specifications and dimensions subject to change

Slider locked Pick and place area ø3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) 1,5 Prohibited area Contact location according to ENV1375-1 & GSM11-11 Plastic outline Contact foot area 0,8 x 1 MICROSIM CARD 2,55 (2,7 max. includes solder tails) Dimensions are shown in mm Specifications and dimensions subject to change

MICROSIM CARD 2,55 (2,7 max. includes solder tails) Slider locked Pick and place area ø 3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) 1,5 5,5 Prohibited area Contact location according to ENV1375-1 & GSM11-11 Plastic outline Contact foot area 0,8 x 1 Dimensions are shown in mm Specifications and dimensions subject to change

Slider locked Pick and place area ø 3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) 1,5 Prohibited area Contact location according to ENV1375-1 & GSM11-11 Plastic outline Contact foot area 0,8 x 1 MICROSIM CARD 2,55 (2,7 max. includes solder tails) Dimensions are shown in mm Specifications and dimensions subject to change

DETAIL insulated blade switch Scale 5 MICROSIM CARD 2,55 (2,7 max. includes solder tails) Slider locked Plastic actuator Pick and place area ø 3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) 1,5 5,5 Prohibited area Contact location according to ENV1375-1 & GSM11-11 Plastic outline Contact foot area 0,8 x 1 Dimensions are shown in mm Specifications and dimensions subject to change

MICROSIM CARD Pick and place area ø 3,5 Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) Plastic outline Contact foot area 1,5 x 1 Pad 2,55 (2,7 max. includes solder tails) Prohibited area Contact location according to ENV1375-1 & GSM11-11 Dimensions are shown in mm Specifications and dimensions subject to change

Mated condition SEE DETAIL A 3,81 3,81 Pick and place area ø 3,5 2,85 (3 max includes solder tails) Card stop XX-XXX ø1,6 Date Code area Prohibited area Contact location according to ENV1375-1 & GSM11-11 Plastic outline Contact foot area 0,8 x 1 Pad Dimensions are shown in mm Specifications and dimensions subject to change

Date code updated Date Code area Card stop RECOMMENDED PC BOARD LAYOUT (Component side) Plastic outline Contact foot area 0,8 x 0,7 Pad Pick and place area ø 3,5 3,81 Contact location according to ENV1375-1 & GSM11-11 Switch contact foot area 0,8 x 1 Dimensions are shown in mm Specifications and dimensions subject to change

CCM03 MK2 Series CCM03-3760 LFT DETAIL A SEE DETAIL A Pick and place area Card stop Date Code area RECOMMENDED PC BOARD LAYOUT (Component side) Plastic outline Contact foot area 0,8 x 0,7 3,81 Contact location according to ENV1375-1 & GSM11-11 5,9 14,25 Dimensions are shown in mm Specifications and dimensions subject to change

Pick and place area First Angle Projection €3# Dimensions are shown in mm Specifications and dimensions subject to change

Typical Applications • Mobile • POS • Identification • GPS Features • SIM and SAM card acceptance • Compatible with pick and place and lead free soldering Number of contacts Mechanical life Card insertion force Card extraction force Contact force Vibration Frequency Shock Max elect. discontinuity 6 or 8 30,000 cycles 10N max 1N min / 10N max 0,35N min to 0,65N 10 to 500 Hz. Acceleration 50m/s2 Duration 6 hours - amplitude 0,35mm Peak value 500 m/s2 - Duration 11 ms 3 shocks in each direction of each axis 1|js Insulation resistance Contact resistance max Switching current Dielectric strength...

Date Code area Pick and place area ø 3,3 RECOMMENDED PC BOARD LAYOUT (Component side) Plastic outline Contact foot area 0,6 x 0,7 Contact location according to ISO 7816-2 & ENV 1375-1 & GSM11-11 Dimensions are shown in mm Specifications and dimensions subject to change