SPECIFICATION PRINTING ENVIRONMENT Print technology: FFF Working temperature: 15-32°C Build volume: 260 x 300 x 340 mm (26 520 cm3) Storage temperature: 0-32°C Number of printheads: 2 per module POWER Printhead temperature: 500°C Buildplate temperature: 160°C Power requirements: 230V AC Chamber temperature: 85°C (active heating] Max power draw: 2700 W Filament chamber temperature: 70°C Communication: USB drive, SD card DIMENSIONS AND MASS SOFTWARE External dimensions: 1200 x 800 x 1100 mm Slicing software: 3DGence SLICER 4.0 CONSTRUCTION SAFETY Filtration: filtration unit Chassis: powder coated steel UPS device: yes, optional Build surface: heated ceramic plate Others: software access overdrive - remote Positioning resolution XY: 0.006 mm shut down

Versatility and best printing results with job-specific printing modules and developed printing profiles TEMPERATURE: up to 265°C NOZZLE DIAMETER: 0,4 mm/0,4 mm MODEL MATERIAL: ABS, PLA, PA, ASA, PP, TPU SUPPORT MATERIAL: ESM-10, HIPS, BVOH TEMPERATURE: up to 265°C NOZZLE DIAMETER: 0,6 mm/0,6 mm MODEL MATERIAL: ABS, ASA, PA-CF, PA-GF, PA, PP SUPPORT MATERIAL: ESM-10, HIPS TEMPERATURE: up to 340°C NOZZLE DIAMETER: 0,4 mm/0,4 mm MODEL MATERIAL: PC, PC-ABS, PC-ESD, PC-CF SUPPORT MATERIAL: ABS, ESM-10 TEMPERATURE: up to 500°C NOZZLE DIAMETER: 0,4 mm/0,4 mm MODEL MATERIAL: PEEK, PEKK SUPPORT MATERIAL:...