MICROELECTRONICS PACKAGING MATERIALS
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ADVANCED MATERIALS GROUP Microelectronics Packaging Materials

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The Challenge To ensure optimal performance and reliability, sensitive electronics must be adequately protected by secure packaging. Hermetic lids are necessary for semiconductor, MEMS, medical or optical applications to shield devices from moisture. RF and microwave packages must meet the demand for very low thermal resistance and very low RF loss. Metals and alloys used for the joining of vacuum electronic devices must be free of contamination that could negatively impact performance. The Solution When it comes to packaging, we've got you covered! We offer a full range of products. n...

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Materion ... Materials to Advance the World’s Technologies LIDS BRAZE & SOLDER ALLOYS CERAMIC PACKAGING We've got you covered - hermetic and non-hermetic lids for semiconductor, MEMS, medical or optical requirements: n Combo-Lids® - pre-assembled solder preform and lid n Micro-Lids™ - for packages smaller than .300 in2 n Seam Seal-Lids™ - for sealing heat sensitive electronics n Solder Reflow-Lids™ - cost alternative to Combo-Lids® n Visi-Lids™ - for optical packages n Epo-Lids™ - Epoxy-coated ceramic for non-hermetic uses n Ceramic Combo-Lids™ - for specialty applications Materials for...

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Packaging Products Preform Material MATERION ADVANCED MATERIALS GROUP is a global advanced materials and services company, dedicated to providing solutions that enable our customers' technologies and drive their growth. Our products include precious and non-precious specialty metals, precision optical filters, inorganic chemicals and powders, specialty coatings, specialty-engineered beryllium alloys, beryllium and beryllium composites, and engineered clad and plated metal systems. The Materion business is structured to enhance our ability to provide customers with innovative, best...

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