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BondMaster 600

BondMaster 600
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Composite Bond Tester OLYMPUS —BondMaster 600 Your Vision, Our Future • High signal quality • Multiple modes • Application presets • Full-screen display • Complete archiving and reporting solution

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BondMaster 600 Multimode Bond Tester Simplified Interface and Vibrant Display High Performance Through Intuitive Operation Instant Configuration and Direct Access to All Settings The BondMaster® 600 bond tester delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 bond tester offers exceptional ease-of-use thanks to its direct-access keys and a streamlined interface...

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Signal Quality Beyond Comparison Resonance Mode Presets to Meet Your Needs Enhance Your Honeycomb Composite Inspection Capability Easy Inspection of Metal-to-Metal Bonds and Laminate Composites During bond testing inspections, the pitch-catch probe produces flexural plate waves and compression waves and compares changes in the signal amplitude between the probe’s transmitter and receiver as it passes over the inspected part, detecting disbonds on both the near and far side. The BondMaster® 600 bond tester offers three Pitch-Catch mode options: RF (fixed frequency waveform), Impulse (legacy...

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Detect Small Disbonds in Honeycomb Composite Complete Inspection, Archiving, and Reporting Solution Simplified Workflow for Any Level of User The bond testing mechanical impedance analysis (MIA) method measures the mechanical impedance, or stiffness, of a material. MIA probes emit a fixed, audible frequency. Changes in material stiffness are indicated as signal amplitude and phase changes in the X-Y view of the BondMaster® 600 bond tester. The BondMaster® 600 bond tester offers a completely streamlined and straightforward process for tracking your inspection results. Built-in features such...

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For a complete specifications list, please download the full BondMaster® 600 user’s manual at www.olympus-ims.com. General Overall Dimensions (W x H x D) Weight Power Requirements 236 mm x 167 mm x 70 mm (9.3 in. x 6.57 in. x 2.76 in.) 1.70 kg (3.75 lb), including lithium-ion battery Mil Standard 810G, CE, WEEE, FCC (USA), IC (Canada), RoHS (China), RCM (Australia and New Zealand), KCC (South Korea) AC Mains: 100 VAC to 120 VAC, 200 VAC to 240 VAC, 50 Hz to 60 Hz Probes Types Supported Pitch-Catch, Mechanical Impedance Analysis (MIA-B600M only), and Resonance probes (B600M only). Probe...

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BondMaster 600 1 / 5Pagine

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BondMaster 600
1 / 5Pagine