K_Chips
1 / 1Pagine

K_SERIES_Technical Data Sheet_K_CHIP KOMATSU SEIREN cecence STANDARD SPECIFICATION BEND BEND STRENGTH MODULUS (Mpa) (Gpa) PROCESSING TEMP (°C) The above mentioned data is a central value. It is not a guaranteed performance. UK fi E UROPE ENQUIRIES CECENCE LTD UNI 2 C N R LYSANDER WAY OLD SARUM SAL WILT SHIRE SP4 6 U t: +44 1722 327775 m: + i 7453 293828 e: info® cecence.com